16Mb, Multiple I/O Serial Flash Memory
Features
Micron Serial NOR Flash Memory
1.8V, Multiple I/O, 4KB Sector Erase
N25Q016A11E
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
• Deep power-down mode: 5µA (TYP)
• Write protection
– Software write protection applicable to every
64KB sector via volatile lock bit
– Hardware write protection: protected area size
defined by five nonvolatile bits (BP0, BP1, BP2,
and TB)
– Additional smart protections, available upon request
• Electronic signature
– JEDEC-standard 2-byte signature (BB15h)
– Two additional extended device ID (EDID) bytes
to identify device factory options
– Unique ID code (UID): 14 read-only bytes
• Minimum 100,000 ERASE cycles per sector
• More than 20 years data retention
• Packages JEDEC standard, all RoHS compliant
– F4 = U-PDFN-8/4mm x 3mm (MLP8)
– F6 = V-PDFN-8/6mm x 5mm (MLP8)
– SC = SOP2-8/150 mil (SO8N)
– 51 = XF-SCSP-8/2mm x 2.8mm (XFCSP)
SPI-compatible serial bus interface
108 MHz (MAX) clock frequency
1.7–2.0V single supply voltage
Dual/quad I/O instruction provides increased
throughput up to 432 MB/s
Supported protocols
– Extended SPI, dual I/O, and quad I/O
Execute-in-place (XIP) mode for all three protocols
– Configurable via volatile or nonvolatile registers
– Enables memory to work in XIP mode directly after power-on
PROGRAM/ERASE SUSPEND operations
Continuous read of entire memory via a single command
– Fast read
– Quad or dual output fast read
– Quad or dual I/O fast read
Flexible to fit application
– Configurable number of dummy cycles
– Output buffer configurable
Software reset
Hardware RESET function available upon customer
request
64-byte, user-lockable, one-time programmable
(OTP) dedicated area
Erase capability
– Subsector erase 4KB uniform granularity blocks
– Subsector erase 32KB uniform granularity blocks
– Sector erase 64KB uniform granularity blocks
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
16Mb, Multiple I/O Serial Flash Memory
Features
Contents
Device Description ........................................................................................................................................... 6
Features ....................................................................................................................................................... 6
3-Byte Address Modes .................................................................................................................................. 6
Operating Protocols ...................................................................................................................................... 6
XIP Mode ..................................................................................................................................................... 6
Device Configurability .................................................................................................................................. 7
Signal Assignments ........................................................................................................................................... 8
Signal Descriptions ........................................................................................................................................... 9
Memory Organization .................................................................................................................................... 11
Memory Configuration and Block Diagram .................................................................................................. 11
Memory Map ............................................................................................................................................. 12
Device Protection ........................................................................................................................................... 13
Serial Peripheral Interface Modes .................................................................................................................... 15
SPI Protocols .................................................................................................................................................. 17
Nonvolatile and Volatile Registers ................................................................................................................... 18
Status Register ............................................................................................................................................ 19
Nonvolatile and Volatile Configuration Registers .......................................................................................... 20
Enhanced Volatile Configuration Register .................................................................................................... 23
Flag Status Register ..................................................................................................................................... 24
Command Definitions .................................................................................................................................... 25
READ REGISTER and WRITE REGISTER Operations ........................................................................................ 27
READ STATUS REGISTER or FLAG STATUS REGISTER Command ................................................................ 27
READ NONVOLATILE CONFIGURATION REGISTER Command ................................................................... 28
READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command .................................. 28
WRITE STATUS REGISTER Command ......................................................................................................... 28
WRITE NONVOLATILE CONFIGURATION REGISTER Command ................................................................. 29
WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command ................................. 29
READ LOCK REGISTER Command .............................................................................................................. 30
WRITE LOCK REGISTER Command ............................................................................................................ 31
CLEAR FLAG STATUS REGISTER Command ................................................................................................ 32
READ IDENTIFICATION Operations ............................................................................................................... 33
READ ID and MULTIPLE I/O READ ID Commands ...................................................................................... 33
READ SERIAL FLASH DISCOVERY PARAMETER Command ......................................................................... 34
READ MEMORY Operations ............................................................................................................................ 38
PROGRAM Operations .................................................................................................................................... 42
WRITE Operations .......................................................................................................................................... 47
WRITE ENABLE Command ......................................................................................................................... 47
WRITE DISABLE Command ........................................................................................................................ 47
ERASE Operations .......................................................................................................................................... 49
SUBSECTOR ERASE Command ................................................................................................................... 49
SECTOR ERASE Command ......................................................................................................................... 49
BULK ERASE Command ............................................................................................................................. 50
PROGRAM/ERASE SUSPEND Command ..................................................................................................... 51
PROGRAM/ERASE RESUME Command ...................................................................................................... 53
RESET Operations .......................................................................................................................................... 54
RESET ENABLE and RESET MEMORY Command ........................................................................................ 54
RESET Conditions ...................................................................................................................................... 54
ONE TIME PROGRAMMABLE Operations ....................................................................................................... 55
READ OTP ARRAY Command ...................................................................................................................... 55
PROGRAM OTP ARRAY Command .............................................................................................................. 55
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16Mb, Multiple I/O Serial Flash Memory
Features
XIP Mode .......................................................................................................................................................
Activate or Terminate XIP Using Volatile Configuration Register ...................................................................
Activate or Terminate XIP Using Nonvolatile Configuration Register .............................................................
Confirmation Bit Settings Required to Activate or Terminate XIP ..................................................................
Terminating XIP After a Controller and Memory Reset .................................................................................
Power Up and Power Down .............................................................................................................................
Power Up and Power Down Requirements ...................................................................................................
Power Loss Recovery Sequence ...................................................................................................................
AC Reset Specifications ...................................................................................................................................
Absolute Ratings and Operating Conditions .....................................................................................................
DC Characteristics and Operating Conditions ..................................................................................................
AC Characteristics and Operating Conditions ..................................................................................................
Package Dimensions .......................................................................................................................................
Part Number Ordering Information .................................................................................................................
Revision History .............................................................................................................................................
Rev. G – 1/2016 ...........................................................................................................................................
Rev. F – 1/2014 ...........................................................................................................................................
Rev. E – 7/2013 ...........................................................................................................................................
Rev. D – 7/2012 ...........................................................................................................................................
Rev. C – 6/2012 ...........................................................................................................................................
Rev. B – 5/2012 ...........................................................................................................................................
Rev. A – 2/2012 ...........................................................................................................................................
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60
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62
66
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77
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16Mb, Multiple I/O Serial Flash Memory
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 7
Figure 2: SO8N, MLP8 TSOP (Top View) ........................................................................................................... 8
Figure 3: 8-Balls, XFCSP, 2mm x 2.8mm x 0.37mm (Top View) ........................................................................... 8
Figure 4: Block Diagram ................................................................................................................................ 11
Figure 5: Bus Master and Memory Devices on the SPI Bus ............................................................................... 16
Figure 6: SPI Modes ....................................................................................................................................... 16
Figure 7: Internal Configuration Register ........................................................................................................ 18
Figure 8: READ REGISTER Command ............................................................................................................ 27
Figure 9: WRITE REGISTER Command ........................................................................................................... 29
Figure 10: READ LOCK REGISTER Command ................................................................................................. 31
Figure 11: WRITE LOCK REGISTER Command ............................................................................................... 32
Figure 12: READ ID and MULTIPLE I/O Read ID Commands .......................................................................... 34
Figure 13: READ Command ........................................................................................................................... 39
Figure 14: FAST READ Command ................................................................................................................... 39
Figure 15: DUAL OUTPUT FAST READ ........................................................................................................... 40
Figure 16: DUAL INPUT/OUTPUT FAST READ Command .............................................................................. 40
Figure 17: QUAD OUTPUT FAST READ Command ......................................................................................... 41
Figure 18: QUAD INPUT/OUTPUT FAST READ Command ............................................................................. 41
Figure 19: PAGE PROGRAM Command .......................................................................................................... 43
Figure 20: DUAL INPUT FAST PROGRAM Command ...................................................................................... 44
Figure 21: EXTENDED DUAL INPUT FAST PROGRAM Command ................................................................... 44
Figure 22: QUAD INPUT FAST PROGRAM Command ..................................................................................... 45
Figure 23: EXTENDED QUAD INPUT FAST PROGRAM Command ................................................................... 46
Figure 24: WRITE ENABLE and WRITE DISABLE Command Sequence ............................................................ 48
Figure 25: SUBSECTOR and SECTOR ERASE Command .................................................................................. 50
Figure 26: BULK ERASE Command ................................................................................................................ 51
Figure 27: RESET ENABLE and RESET MEMORY Command ........................................................................... 54
Figure 28: READ OTP Command .................................................................................................................... 55
Figure 29: PROGRAM OTP Command ............................................................................................................ 56
Figure 30: XIP Mode Directly After Power-On .................................................................................................. 58
Figure 31: Power-Up Timing .......................................................................................................................... 60
Figure 32: Reset AC Timing During PROGRAM or ERASE Cycle ........................................................................ 63
Figure 33: Reset Enable ................................................................................................................................. 63
Figure 34: Serial Input Timing ........................................................................................................................ 63
Figure 35: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1) ................... 64
Figure 36: Hold Timing .................................................................................................................................. 64
Figure 37: Output Timing .............................................................................................................................. 65
Figure 38: V PPH Timing .................................................................................................................................. 65
Figure 39: AC Timing Input/Output Reference Levels ...................................................................................... 67
Figure 40: UFDFPN8-4×3 mm ........................................................................................................................ 71
Figure 41: DFN-6 x 5mm ................................................................................................................................ 72
Figure 42: S08N-150mils ................................................................................................................................ 73
Figure 43: XFCSP-2x2.8mm ............................................................................................................................ 74
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16Mb, Multiple I/O Serial Flash Memory
Features
List of Tables
Table 1: Signal Descriptions ............................................................................................................................. 9
Table 2: Sectors 31 : 0 ..................................................................................................................................... 12
Table 3: Data Protection using Device Protocols ............................................................................................. 13
Table 4: Memory Sector Protection Truth Table .............................................................................................. 13
Table 5: Protected Area Sizes – Upper Area ..................................................................................................... 14
Table 6: Protected Area Sizes – Lower Area ...................................................................................................... 14
Table 7: SPI Modes ........................................................................................................................................ 15
Table 8: Extended, Dual, and Quad SPI Protocols ............................................................................................ 17
Table 9: Status Register Bit Definitions ........................................................................................................... 19
Table 10: Nonvolatile Configuration Register Bit Definitions ........................................................................... 20
Table 11: Volatile Configuration Register Bit Definitions .................................................................................. 21
Table 12: Sequence of Bytes During Wrap ....................................................................................................... 22
Table 13: Supported Clock Frequencies .......................................................................................................... 22
Table 14: Enhanced Volatile Configuration Register Bit Definitions .................................................................. 23
Table 15: Flag Status Register Bit Definitions .................................................................................................. 24
Table 16: Command Set ................................................................................................................................. 25
Table 17: Lock Register .................................................................................................................................. 30
Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands ....................................... 33
Table 19: Read ID Data Out ............................................................................................................................ 33
Table 20: Extended Device ID, First Byte ......................................................................................................... 33
Table 21: Serial Flash Discovery Parameter Data Structure .............................................................................. 35
Table 22: Parameter ID .................................................................................................................................. 36
Table 23: Command/Address/Data Lines for READ MEMORY Commands ....................................................... 38
Table 24: Data/Address Lines for PROGRAM Commands ................................................................................ 42
Table 25: Suspend Parameters ....................................................................................................................... 52
Table 26: Operations Allowed/Disallowed During Device States ...................................................................... 52
Table 27: Reset Command Set ........................................................................................................................ 54
Table 28: OTP Control Byte (Byte 64) .............................................................................................................. 56
Table 29: XIP Confirmation Bit ....................................................................................................................... 58
Table 30: Effects of Running XIP in Different Protocols .................................................................................... 58
Table 31: Power-Up Timing and V WI Threshold ............................................................................................... 61
Table 32: AC RESET Conditions ...................................................................................................................... 62
Table 33: Absolute Ratings ............................................................................................................................. 66
Table 34: Operating Conditions ...................................................................................................................... 66
Table 35: Input/Output Capacitance .............................................................................................................. 66
Table 36: AC Timing Input/Output Conditions ............................................................................................... 67
Table 37: DC Current Characteristics and Operating Conditions ...................................................................... 68
Table 38: DC Voltage Characteristics and Operating Conditions ...................................................................... 68
Table 39: AC Characteristics and Operating Conditions ................................................................................... 69
Table 40: Part Number Information ................................................................................................................ 75
Table 41: Package Details ............................................................................................................................... 75
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16Mb, Multiple I/O Serial Flash Memory
Device Description
Device Description
The N25Q is the first high-performance multiple input/output serial Flash memory device manufactured on 65nm NOR technology. It features execute-in-place (XIP) functionality, advanced write protection mechanisms, and a high-speed SPI-compatible bus
interface. The innovative, high-performance, dual and quad input/output instructions
enable double or quadruple the transfer bandwidth for READ and PROGRAM operations.
Features
The memory is organized as 32 (64KB) main sectors that are divided into two subsectors
each (32KB), that are further divided into eight 4KB subsectors each, 512 4KB subsectors in total. The memory can be erased one 4KB subsector at a time, one 32KB subsector at a time, one 64KB sector at a time, or as a whole.
The memory can be write protected by software through volatile and nonvolatile protection features, depending on the application needs. The protection granularity is of
64KB (sector granularity) for volatile protections
The device has 64 one-time programmable (OTP) bytes that can be read and programmed with the READ OTP and PROGRAM OTP commands. These 64 bytes can also be
permanently locked with a PROGRAM OTP command.
The device also has the ability to pause and resume PROGRAM and ERASE cycles by using dedicated PROGRAM/ERASE SUSPEND and RESUME instructions.
3-Byte Address Modes
The device features 3-byte address modes to access the memory.
Operating Protocols
The memory can be operated with three different protocols:
• Extended SPI (standard SPI protocol upgraded with dual and quad operations)
• Dual I/O SPI
• Quad I/O SPI
The standard SPI protocol is extended and enhanced by dual and quad operations. In
addition, the dual SPI and quad SPI protocols improve the data access time and
throughput of a single I/O device by transmitting commands, addresses, and data
across two or four data lines.
XIP Mode
XIP mode requires only an address (no instruction) to output data, improving random
access time and eliminating the need to shadow code onto RAM for fast execution.
All protocols support XIP operation. For flexibility, multiple XIP entry and exit methods
are available. For applications that must enter XIP mode immediately after powering
up, XIP mode can be set as the default mode through the nonvolatile configuration register bits.
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16Mb, Multiple I/O Serial Flash Memory
Device Description
Device Configurability
The N25Q family offers additional features that are configured through the nonvolatile
configuration register for default and/or nonvolatile settings. Volatile settings can be
configured through the volatile and volatile-enhanced configuration registers. These
configurable features include the following:
•
•
•
•
•
•
Number of dummy cycles for the fast READ commands
Output buffer impedance
SPI protocol types (extended SPI, DIO-SPI, or QIO-SPI)
Required XIP mode
Enabling/disabling HOLD (RESET function)
Enabling/disabling wrap mode
Figure 1: Logic Diagram
VCC
DQ0
DQ1
C
S#
VPP/W#/DQ2
HOLD#/DQ3
VSS
Note:
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1. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for more details.
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16Mb, Multiple I/O Serial Flash Memory
Signal Assignments
Signal Assignments
Figure 2: SO8N, MLP8 TSOP (Top View)
Note:
S#
1
8
VCC
DQ1
2
7
HOLD#/DQ3
W#/VPP/DQ2
3
6
C
VSS
4
5
DQ0
1. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for complete package names and details.
Figure 3: 8-Balls, XFCSP, 2mm x 2.8mm x 0.37mm (Top View)
A
1
2
VCC
S#
B
DQ1
HOLD#/DQ3
C
C
W#/VPP/DQ2
D
Note:
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DQ0
VSS
1. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for complete package names and details.
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16Mb, Multiple I/O Serial Flash Memory
Signal Descriptions
Signal Descriptions
The signal description table below is a comprehensive list of signals for the N25Q family
devices. All signals listed may not be supported on this device. See Signal Assignments
for information specific to this device.
Table 1: Signal Descriptions
Symbol
Type
Description
C
Input
Clock: Provides the timing of the serial interface. Commands, addresses, or data present at serial data inputs are latched on the rising edge of the clock. Data is shifted out on the falling
edge of the clock.
S#
Input
Chip select: When S# is HIGH, the device is deselected and DQ1 is at High-Z. When in extended SPI mode, with the device deselected, DQ1 is tri-stated. Unless an internal PROGRAM,
ERASE, or WRITE STATUS REGISTER cycle is in progress, the device enters standby power mode
(not deep power-down mode). Driving S# LOW enables the device, placing it in the active power mode. After power-up, a falling edge on S# is required prior to the start of any command.
DQ0
Input
and I/O
Serial data: Transfers data serially into the device. It receives command codes, addresses, and
the data to be programmed. Values are latched on the rising edge of the clock. DQ0 is used for
input/output during the following operations: DUAL OUTPUT FAST READ, QUAD OUTPUT FAST
READ, DUAL INPUT/OUTPUT FAST READ, and QUAD INPUT/OUTPUT FAST READ. When used for
output, data is shifted out on the falling edge of the clock.
In DIO-SPI, DQ0 always acts as an input/output.
In QIO-SPI, DQ0 always acts as an input/output, with the exception of the PROGRAM or ERASE
cycle performed with VPP. The device temporarily enters the extended SPI protocol and then returns to QIO-SPI as soon as VPP goes LOW.
DQ1
Output
and I/O
Serial data:Transfers data serially out of the device. Data is shifted out on the falling edge of
the clock. DQ1 is used for input/output during the following operations: DUAL INPUT FAST
PROGRAM, QUAD INPUT FAST PROGRAM, DUAL INPUT EXTENDED FAST PROGRAM, and QUAD
INPUT EXTENDED FAST PROGRAM. When used for input, data is latched on the rising edge of
the clock.
In DIO-SPI, DQ1 always acts as an input/output.
In QIO-SPI, DQ1 always acts as an input/output, with the exception of the PROGRAM or ERASE
cycle performed with the enhanced program supply voltage (VPP). In this case the device temporarily enters the extended SPI protocol and then returns to QIO-SPI as soon as VPP goes LOW.
DQ2
Input
and I/O
DQ2: When in QIO-SPI mode or in extended SPI mode using QUAD FAST READ commands, the
signal functions as DQ2, providing input/output.
All data input drivers are always enabled except when used as an output. Micron recommends
customers drive the data signals normally (to avoid unnecessary switching current) and float
the signals before the memory device drives data on them.
DQ3
Input
and I/O
DQ3: When in quad SPI mode or in extended SPI mode using quad FAST READ commands, the
signal functions as DQ3, providing input/output. HOLD# is disabled and RESET# is disabled if
the device is selected.
RESET#
Control
Input
RESET: This is a hardware RESET# signal. When RESET# is driven HIGH, the memory is in the
normal operating mode. When RESET# is driven LOW, the memory enters reset mode and output is High-Z. If RESET# is driven LOW while an internal WRITE, PROGRAM, or ERASE operation
is in progress, data may be lost.
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16Mb, Multiple I/O Serial Flash Memory
Signal Descriptions
Table 1: Signal Descriptions (Continued)
Symbol
Type
HOLD#
Control
Input
HOLD: Pauses any serial communications with the device without deselecting the device. DQ1
(output) is High-Z. DQ0 (input) and the clock are "Don't Care." To enable HOLD, the device
must be selected with S# driven LOW.
HOLD# is used for input/output during the following operations: QUAD OUTPUT FAST READ,
QUAD INPUT/OUTPUT FAST READ, QUAD INPUT FAST PROGRAM, and QUAD INPUT EXTENDED
FAST PROGRAM.
In QIO-SPI, HOLD# acts as an I/O (DQ3 functionality), and the HOLD# functionality is disabled
when the device is selected. When the device is deselected (S# is HIGH) in parts with RESET#
functionality, it is possible to reset the device unless this functionality is not disabled by means
of dedicated registers bits.
The HOLD# functionality can be disabled using bit 4 of the NVCR or bit 4 of the VECR.
W#
Control
Input
Write protect: W# can be used as a protection control input or in QIO-SPI operations. When in
extended SPI with single or dual commands, the WRITE PROTECT function is selectable by the
voltage range applied to the signal. If voltage range is low (0V to VCC), the signal acts as a
write protection control input. The memory size protected against PROGRAM or ERASE operations is locked as specified in the status register block protect bits 3:0.
W# is used as an input/output (DQ2 functionality) during QUAD INPUT FAST READ and QUAD
INPUT/OUTPUT FAST READ operations and in QIO-SPI.
VPP
Power
Supply voltage: If VPP is in the voltage range of VPPH, the signal acts as an additional power
supply, as defined in the AC Measurement Conditions table.
During QIFP, QIEFP, and QIO-SPI PROGRAM/ERASE operations, it is possible to use the additional VPP power supply to speed up internal operations. However, to enable this functionality, it is
necessary to set bit 3 of the VECR to 0.
In this case, VPP is used as an I/O until the end of the operation. After the last input data is shifted in, the application should apply VPP voltage to VPP within 200ms to speed up the internal
operations. If the VPP voltage is not applied within 200ms, the PROGRAM/ERASE operations
start at standard speed.
The default value of VECR bit 3 is 1, and the VPP functionality for quad I/O modify operations is
disabled.
VCC
Power
Device core power supply: Source voltage.
VSS
Ground
DNU
–
Do not use.
NC
–
No connect.
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Description
Ground: Reference for the VCC supply voltage.
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16Mb, Multiple I/O Serial Flash Memory
Memory Organization
Memory Organization
Memory Configuration and Block Diagram
Each page of memory can be individually programmed. Bits are programmed from one
through zero. The device is subsector, sector, or bulk-erasable, but not page-erasable.
Bits are erased from zero through one. The memory is configured as 2,097,152 bytes (8
bits each); 32 sectors (64KB each); 512 subsectors (4KB each); and 8192 pages (256 bytes
each); and 64 OTP bytes are located outside the main memory array.
Figure 4: Block Diagram
HOLD#
W#/VPP
High voltage
generator
Control logic
64 OTP bytes
S#
C
DQ0
DQ1
DQ2
DQ3
I/O shift register
Address register
and counter
Status
register
256 byte
data buffer
Y decoder
1FFFFFh
000000h
000FFFh
256 bytes (page size)
X decoder
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16Mb, Multiple I/O Serial Flash Memory
Memory Organization
Memory Map
Table 2: Sectors 31 : 0
Address Range
Sector
32KB Subsector
4KB Subsector
Start
End
31
63
511
1F F000h
1F FFFFh
⋮
⋮
⋮
504
1F 8000h
1F 8FFFh
503
1F 7000h
1F 7FFFh
⋮
⋮
⋮
496
1F 0000h
1F 0FFFh
495
1E F000h
1E FFFFh
⋮
⋮
⋮
488
1E 8000h
1E 8FFFh
487
1E 7000h
1E 7FFFh
62
30
61
60
⋮
⋮
⋮
480
1E 0000h
1E 0FFFh
⋮
⋮
⋮
⋮
⋮
1
3
31
01 F000h
01 FFFFh
2
0
1
0
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⋮
⋮
⋮
24
01 8000h
01 8FFFh
23
01 7000h
01 7FFFh
⋮
⋮
⋮
16
01 0000h
01 0FFFh
15
00 F000h
00 FFFFh
⋮
⋮
⋮
8
00 8000h
00 8FFFh
7
00 7000h
00 7FFFh
⋮
⋮
⋮
0
00 0000h
00 0FFFh
12
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16Mb, Multiple I/O Serial Flash Memory
Device Protection
Device Protection
Table 3: Data Protection using Device Protocols
Note 1 applies to the entire table
Protection by:
Description
Power-on reset and internal timer
Protects the device against inadvertent data changes while the power supply is outside the operating specification.
Command execution check
Ensures that the number of clock pulses is a multiple of one byte before executing a
PROGRAM or ERASE command, or any command that writes to the device registers.
WRITE ENABLE operation
Ensures that commands modifying device data must be preceded by a WRITE ENABLE
command, which sets the write enable latch bit in the status register.
Note:
1. Extended, dual, and quad SPI protocol functionality ensures that device data is protected from excessive noise.
Table 4: Memory Sector Protection Truth Table
Note 1 applies to the entire table
Sector Lock Register
Sector Lock
Down Bit
Sector Write Lock
Bit
0
0
Sector unprotected from PROGRAM and ERASE operations. Protection status
reversible.
0
1
Sector protected from PROGRAM and ERASE operations. Protection status
reversible.
1
0
Sector unprotected from PROGRAM and ERASE operations. Protection status not
reversible except by power cycle or reset.
1
1
Sector protected from PROGRAM and ERASE operations. Protection status not
reversible except by power cycle or reset.
Note:
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Memory Sector Protection Status
1. Sector lock register bits are written to when the WRITE TO LOCK REGISTER command is
executed. The command will not execute unless the sector lock down bit is cleared (see
the WRITE TO LOCK REGISTER command).
13
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16Mb, Multiple I/O Serial Flash Memory
Device Protection
Table 5: Protected Area Sizes – Upper Area
Note 1 applies to the entire table
Status Register Content
Memory Content
Top/
Bottom
Bit
BP2
BP1
BP0
Protected Area
Unprotected Area
0
0
0
0
None
All sectors (0–31)
0
0
0
1
Upper 32nd (sector 31)
Lower 31/32nds (0–30)
0
0
1
0
Upper 16th (sectors 30 and 31)
Lower 15/16ths (0–29)
0
0
1
1
Upper 8th (sectors 28–31)
Lower 7/8th (0–27)
0
1
0
0
Upper 4th (sectors 24–31)
Lower 3/4th (0–23)
0
1
0
1
Upper half (sectors 16–31)
Lower half (0–15)
0
1
1
0
All sectors (0–31)
None
0
1
1
1
All sectors (0–31)
None
Note:
1. See the Status Register for details on the top/bottom bit and the BP 2:0 bits.
Table 6: Protected Area Sizes – Lower Area
Note 1 applies to the entire table
Status Register Content
Memory Content
Top/
Bottom
Bit
BP2
BP1
BP0
1
0
0
0
None
All sectors (0–31)
1
0
0
1
Lower 32nd (sector 0)
Upper 31/32nds (1–31)
1
0
1
0
Lower 16th (sectors 0 and 1)
Upper 15/16ths (2–31)
1
0
1
1
Lower 8th (sectors 0–3)
Upper 7/8th (4–31)
1
1
0
0
Lower 4th (sectors 0–7)
Upper 3/4th (8–31)
1
1
0
1
Lower half (sectors 0–15)
Upper half (16–31)
1
1
1
0
All sectors (0–31)
None
1
1
1
1
All sectors (0–31)
None
Note:
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Protected Area
Unprotected Area
1. See the Status Register for details on the top/bottom bit and the BP 2:0 bits.
14
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16Mb, Multiple I/O Serial Flash Memory
Serial Peripheral Interface Modes
Serial Peripheral Interface Modes
The device can be driven by a microcontroller while its serial peripheral interface is in
either of the two modes shown here. The difference between the two modes is the clock
polarity when the bus master is in standby mode and not transferring data. Input data is
latched in on the rising edge of the clock, and output data is available from the falling
edge of the clock.
Table 7: SPI Modes
Note:
Note 1 applies to the entire table
SPI Modes
Clock Polarity
CPOL = 0, CPHA = 0
C remains at 0 for (CPOL = 0, CPHA = 0)
CPOL = 1, CPHA = 1
C remains at 1 for (CPOL = 1, CPHA = 1)
1. The listed SPI modes are supported in extended, dual, and quad SPI protocols.
Shown below is an example of three memory devices in extended SPI protocol in a simple connection to an MCU on an SPI bus. Because only one device is selected at a time,
that one device drives DQ1, while the other devices are High-Z.
Resistors ensure the device is not selected if the bus master leaves S# High-Z. The bus
master might enter a state in which all input/output is High-Z simultaneously, such as
when the bus master is reset. Therefore, the serial clock must be connected to an external pull-down resistor so that S# is pulled HIGH while the serial clock is pulled LOW.
This ensures that S# and the serial clock are not HIGH simultaneously and that tSHCH
is met. The typical resistor value of 100kΩ, assuming that the time constant R × Cp (Cp =
parasitic capacitance of the bus line), is shorter than the time the bus master leaves the
SPI bus in High-Z.
Example: Cp = 50pF, that is R × Cp = 5μs. The application must ensure that the bus master never leaves the SPI bus High-Z for a time period shorter than 5μs. W# and HOLD#
should be driven either HIGH or LOW, as appropriate.
PDF: 09005aef84a4754f
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15
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16Mb, Multiple I/O Serial Flash Memory
Serial Peripheral Interface Modes
Figure 5: Bus Master and Memory Devices on the SPI Bus
VSS
VCC
R
SDO
SPI interface:
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
VCC
C
SPI bus master
DQ1 DQ0
R
CS3
SPI memory
device
VCC
C
VSS
R
DQ1
DQ0
SPI memory
device
VCC
C
VSS
R
DQ1 DQ0
VSS
SPI memory
device
CS2 CS1
S#
W# HOLD#
S#
W# HOLD#
S#
W# HOLD#
Figure 6: SPI Modes
CPOL CPHA
0
0
C
1
1
C
DQ0
MSB
DQ1
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MSB
16
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16Mb, Multiple I/O Serial Flash Memory
SPI Protocols
SPI Protocols
Table 8: Extended, Dual, and Quad SPI Protocols
Protocol
Name
Command
Input
Extended
DQ0
Multiple DQn
lines, depending
on the command
Dual
DQ[1:0]
DQ[1:0]
Address
Input
Data
Input/Output
Description
Multiple DQn
Device default protocol from the factory. Additional comlines, depending mands extend the standard SPI protocol and enable address
on the command or data transmission on multiple DQn lines.
DQ[1:0]
Volatile selectable: When the enhanced volatile configuration register bit 6 is set to 0, the device enters the dual SPI
protocol immediately after the next WRITE ENHANCED
VOLATILE CONFIGURATION REGISTER command. The device
returns to the default protocol after the next power-on.In
addition, the device can return to default protocol using
the rescue sequence, without power-off or power-on.
Nonvolatile selectable: When nonvolatile configuration
register bit 2 is set, the device enters the dual SPI protocol
after the next power-on. Once this register bit is set, the device defaults to the dual SPI protocol after all subsequent
power-on sequences until the nonvolatile configuration
register bit is reset to 1.
Quad1
DQ[3:0]
DQ[3:0]
DQ[3:0]
Volatile selectable: When enhanced volatile configuration
register bit 7 is set to 0, the device enters the quad SPI protocol immediately after the next WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command. The device returns to the default protocol after the next power-on. In addition, the device can return to default protocol using the
rescue sequence, without power-off or power-on.
Nonvolatile selectable: When nonvolatile configuration
register bit 3 is set to 0, the device enters the quad SPI protocol after the next power-on. Once this register bit is set,
the device defaults to the quad SPI protocol after all subsequent power-on sequences until the nonvolatile configuration register bit is reset to 1.
Note:
PDF: 09005aef84a4754f
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1. In quad SPI protocol, all command/address input and data I/O are transmitted on four
lines except during a PROGRAM and ERASE cycle performed with VPP. In this case, the
device enters the extended SPI protocol to temporarily allow the application to perform
a PROGRAM/ERASE SUSPEND operation or to check the write-in-progress bit in the status register or the program/erase controller bit in the flag status register. Then, when
VPP goes LOW, the device returns to the quad SPI protocol.
17
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Nonvolatile and Volatile Registers
The device features the following volatile and nonvolatile registers that users can access
to store device parameters and operating configurations:
•
•
•
•
•
Status register
Nonvolatile and volatile configuration registers
Enhanced volatile configuration register
Flag status register
Lock register
Note: The lock register is defined in READ LOCK REGISTER Command.
In addition to these user-accessible registers, the working condition of memory is set by
an internal configuration register that is not directly accessible to users. As shown below, parameters in the internal configuration register are loaded from the nonvolatile
configuration register during each device boot phase or power-on reset. In this sense,
then, the nonvolatile configuration register contains the default settings of memory.
Also, during the life of an application, each time a WRITE VOLATILE or ENHANCED
VOLATILE CONFIGURATION REGISTER command executes to set configuration parameters in these respective registers, these new settings are copied to the internal configuration register. Therefore, memory settings can be changed in real time. However, at
the next power-on reset, the memory boots according to the memory settings defined
in the nonvolatile configuration register parameters.
Figure 7: Internal Configuration Register
Nonvolatile configuration register
Register download is executed only during
the power-on phase or after a reset,
overwriting configuration register settings
on the internal configuration register.
Volatile configuration register and
enhanced volatile configuration register
Internal configuration
register
Register download is executed after a
WRITE VOLATILE OR ENHANCED VOLATILE
CONFIGURATION REGISTER command,
overwriting configuration register
settings on the internal configuration register.
Device behavior
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18
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Status Register
Table 9: Status Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
Description
Notes
7
Status register
0 = Enabled
write enable/disable 1 = Disabled
Nonvolatile bit: Used with the W/VPP signal to enable or
disable writing to the status register.
6
Reserved
0
Reserved
5
Top/bottom
0 = Top
1 = Bottom
Nonvolatile bit: Determines whether the protected memory area defined by the block protect bits starts from the
top or bottom of the memory array.
4
4:2
Block protect 2–0
See Protected Area
Sizes – Upper Area
and Lower Area
tables in Device
Protection
Nonvolatile bit: Defines memory to be software protected against PROGRAM or ERASE operations. When one or
more block protect bits is set to 1, a designated memory
area is protected from PROGRAM and ERASE operations.
4
1
Write enable latch
0 = Cleared (Default) Volatile bit: The device always powers up with this bit
1 = Set
cleared to prevent inadvertent WRITE STATUS REGISTER,
PROGRAM, or ERASE operations. To enable these operations, the WRITE ENABLE operation must be executed first
to set this bit.
2
0
Write in progress
0 = Ready
1 = Busy
Notes:
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Volatile bit: Indicates if one of the following command cycles is in progress:
WRITE STATUS REGISTER
WRITE NONVOLATILE CONFIGURATION REGISTER
PROGRAM
ERASE
3
2
1. Bits can be read from or written to using READ STATUS REGISTER or WRITE STATUS REGISTER commands, respectively.
2. Volatile bits are cleared to 0 by a power cycle or reset.
3. The status register write enable/disable bit, combined with the W#/VPP signal as described in the Signal Descriptions, provides hardware data protection for the device as follows: When the enable/disable bit is set to 1, and the W#/VPP signal is driven LOW, the
status register nonvolatile bits become read-only and the WRITE STATUS REGISTER operation will not execute. The only way to exit this hardware-protected mode is to drive
W#/VPP HIGH.
4. See Protected Area Sizes tables in Device Protection. The BULK ERASE command is executed only if all bits are 0.
19
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Nonvolatile and Volatile Configuration Registers
Table 10: Nonvolatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit Name
Settings
Description
Notes
15:12 Number of
dummy clock
cycles
0000 (identical to 1111)
0001
0010
.
.
1101
1110
1111
Sets the number of dummy clock cycles subsequent to all FAST READ commands.
The default setting targets the maximum allowed frequency and guarantees backward compatibility.
11:9
XIP mode at
power-on reset
000 = XIP: Fast Read
001 = XIP: Dual Output Fast Read
010 = XIP: Dual I/O Fast Read
011 = XIP: Quad Output Fast Read
100 = XIP: Quad I/O Fast Read
101 = Reserved
110 = Reserved
111 = Disabled (Default)
Enables the device to operate in the selected XIP
mode immediately after power-on reset.
8:6
Output driver 000 = Reserved
strength
001 = 90 Ohms
010 = 60 Ohms
011 = 45 Ohms
100 = Reserved
101 = 20 Ohms
110 = 15 Ohms
111 = 30 (Default)
Optimizes impedance at VCC/2 output voltage.
5
Reserved
X
"Don't Care."
4
Reset/hold
0 = Disabled
1 = Enabled (Default)
Enables or disables hold or reset.
(Available on dedicated part numbers.)
3
Quad I/O pro- 0 = Enabled
tocol
1 = Disabled (Default, Extended SPI protocol)
Enables or disables quad I/O protocol.
4
2
Dual I/O protocol
0 = Enabled
1 = Disabled (Default, Extended SPI protocol)
Enables or disables dual I/O protocol.
4
Reserved
X
"Don't Care."
1:0
Notes:
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2, 3
1. Settings determine device memory configuration after power-on. The device ships from
the factory with all bits erased to 1 (FFFFh). The register is read from or written to by
READ NONVOLATILE CONFIGURATION REGISTER or WRITE NONVOLATILE CONFIGURATION REGISTER commands, respectively.
2. The 0000 and 1111 settings are identical in that they both define the default state,
which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.
3. If the number of dummy clock cycles is insufficient for the operating frequency, the
memory reads wrong data. The number of cycles must be set according to and sufficient
20
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
for the clock frequency, which varies by the type of FAST READ command, as shown in
the Supported Clock Frequencies table.
4. If bits 2 and 3 are both set to 0, the device operates in quad I/O. When bits 2 or 3 are
reset to 0, the device operates in dual I/O or quad I/O respectively, after the next poweron.
Table 11: Volatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
7:4
Description
Notes
Number of dummy clock cycles
0000 (identical to 1111)
0001
0010
.
.
1101
1110
1111
Sets the number of dummy clock cycles subsequent to
all FAST READ commands.
The default setting targets maximum allowed frequency and guarantees backward compatibility.
3
XIP
0
1
Enables or disables XIP. For device part numbers with
feature digit equal to 2 or 4, this bit is always "Don’t
Care," so the device operates in XIP mode without setting this bit.
2
Reserved
X = Default
0b = Fixed value.
Wrap
00 = 16-byte boundary
aligned
16-byte wrap: Output data wraps within an aligned 16byte boundary starting from the 3-byte address issued
after the command code.
01 = 32-byte boundary
aligned
32-byte wrap: Output data wraps within an aligned 32byte boundary starting from the 3-byte address issued
after the command code.
10 = 64-byte boundary
aligned
64-byte wrap: Output data wraps within an aligned 64byte boundary starting from the 3-byte address issued
after the command code.
11 = sequential (default)
Continuous reading (default): All bytes are read sequentially.
1:0
Notes:
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2, 3
4
1. Settings determine the device memory configuration upon a change of those settings by
the WRITE VOLATILE CONFIGURATION REGISTER command. The register is read from or
written to by READ VOLATILE CONFIGURATION REGISTER or WRITE VOLATILE CONFIGURATION REGISTER commands respectively.
2. The 0000 and 1111 settings are identical in that they both define the default state,
which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.
3. If the number of dummy clock cycles is insufficient for the operating frequency, the
memory reads wrong data. The number of cycles must be set according to and be sufficient for the clock frequency, which varies by the type of FAST READ command, as
shown in the Supported Clock Frequencies table.
4. See the Sequence of Bytes During Wrap table.
21
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Table 12: Sequence of Bytes During Wrap
Starting Address
16-Byte Wrap
32-Byte Wrap
64-Byte Wrap
0
0-1-2- . . . -15-0-1- . .
0-1-2- . . . -31-0-1- . .
0-1-2- . . . -63-0-1- . .
1
1-2- . . . -15-0-1-2- . .
1-2- . . . -31-0-1-2- . .
1-2- . . . -63-0-1-2- . .
15
15-0-1-2-3- . . . -15-0-1- . .
15-16-17- . . . -31-0-1- . .
15-16-17- . . . -63-0-1- . .
31
–
31-0-1-2-3- . . . -31-0-1- . .
31-32-33- . . . -63-0-1- . .
63
–
–
63-0-1- . . . -63-0-1- . .
Table 13: Supported Clock Frequencies
Note 1 applies to entire table
Number of Dummy
Clock Cycles
FAST READ
DUAL OUTPUT
FAST READ
DUAL I/O FAST
READ
QUAD OUTPUT
FAST READ
QUAD I/O FAST
READ
1
90
80
50
43
30
2
100
90
70
60
40
3
108
100
80
75
50
4
108
105
90
90
60
5
108
108
100
100
70
6
108
108
105
105
80
7
108
108
108
108
86
8
108
108
108
108
95
9
108
108
108
108
105
10
108
108
108
108
108
Note:
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1. Values are guaranteed by characterization and not 100% tested in production.
22
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Enhanced Volatile Configuration Register
Table 14: Enhanced Volatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
Description
Notes
7
Quad I/O protocol
0 = Enabled
Enables or disables quad I/O protocol.
1 = Disabled (Default,
extended SPI protocol)
2
6
Dual I/O protocol
0 = Enabled
Enables or disables dual I/O protocol.
1 = Disabled (Default,
extended SPI protocol)
2
5
Reserved
X = Default
0b = Fixed value.
4
Reset/hold
0 = Disabled
1 = Enabled (Default)
Enables or disables hold or reset.
(Available on dedicated part numbers.)
3
VPP accelerator
0 = Enabled
1 = Disabled (Default)
Enables or disables VPP acceleration for QUAD
INPUT FAST PROGRAM and QUAD INPUT EXTENDED FAST PROGRAM OPERATIONS.
2:0
Output driver strength 000 = Reserved
001 = 90 Ohms
010 = 60 Ohms
011 = 45 Ohms
100 = Reserved
101 = 20 Ohms
110 = 15 Ohms
111 = 30 (Default)
Notes:
PDF: 09005aef84a4754f
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Optimizes impedance at VCC/2 output voltage.
1. Settings determine the device memory configuration upon a change of those settings by
the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command. The register is
read from or written to in all protocols by READ ENHANCED VOLATILE CONFIGURATION
REGISTER or WRITE ENHANCED VOLATILE CONFIGURATION REGISTER commands, respectively.
2. If bits 6 and 7 are both set to 0, the device operates in quad I/O. When either bit 6 or 7 is
reset to 0, the device operates in dual I/O or quad I/O, respectively, following the next
WRITE ENHANCED VOLATILE CONFIGURATION command.
23
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16Mb, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Flag Status Register
Table 15: Flag Status Register Bit Definitions
Note 1 applies to entire table
Bit Name
Settings
Description
Notes
7
Program or
erase
controller
0 = Busy
1 = Ready
Status bit: Indicates whether a PROGRAM, ERASE,
WRITE STATUS REGISTER or WRITE NONVOLATILE CONFIGURATION REGISTER command cycle is in progress.
2, 3
6
Erase suspend
0 = Not in effect
1 = In effect
Status bit: Indicates whether an ERASE operation has
been or is going to be suspended.
3
5
Erase
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether an ERASE operation has
succeeded or failed.
4, 5
4
Program
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether a PROGRAM operation has
succeeded or failed. Also indicates an attempt to program a 0 to a 1 when VPP = VPPH and the data pattern is
a multiple of 64 bits.
4, 5
3
VPP
0 = Enabled
1 = Disabled (Default)
Error bit: Indicates an invalid voltage on VPP during a
PROGRAM or ERASE operation.
4, 5
2
Program
suspend
0 = Not in effect
1 = In effect
Status bit: Indicates whether a PROGRAM operation
has been or is going to be suspended.
3
1
Protection
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether an ERASE or PROGRAM
operation has attempted to modify the protected array
sector, or whether a PROGRAM operation has attempted to access the locked OTP space.
0
Reserved
Reserved
Reserved
Notes:
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4, 5
1. Register bits are read by READ FLAG STATUS REGISTER command. All bits are volatile.
2. These program/erase controller settings apply to these specific PROGRAM, ERASE, and
WRITE command cycles in progress.
3. Status bits are reset automatically.
4. Error bits must be reset by CLEAR FLAG STATUS REGISTER command.
5. Typical errors include operation failures and protection errors caused by issuing a command before the error bit has been reset to 0.
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16Mb, Multiple I/O Serial Flash Memory
Command Definitions
Command Definitions
Table 16: Command Set
Note 1 applies to entire table
Code
Extended
Dual
I/O
Quad
I/O
Data
Bytes
Notes
RESET ENABLE
66h
Yes
Yes
Yes
0
2
RESET MEMORY
99h
Command
RESET Operations
IDENTIFICATION Operations
READ ID
9E/9Fh
Yes
No
No
1 to 20
2
MULTIPLE INPUT/OUTPUT READ ID
AFh
No
Yes
Yes
1 to 3
2
READ SERIAL FLASH
DISCOVERY PARAMETER
5Ah
Yes
Yes
Yes
1 to ∞
3
READ
03h
Yes
No
No
1 to ∞
4
FAST READ
0Bh
Yes
Yes
Yes
DUAL OUTPUT FAST READ
3Bh
Yes
Yes
No
DUAL INPUT/OUTPUT FAST READ
0Bh
3Bh
BBh
Yes
Yes
No
QUAD OUTPUT FAST READ
6Bh
Yes
No
Yes
QUAD INPUT/OUTPUT FAST READ
0Bh
6Bh
EBh
Yes
No
Yes
WRITE ENABLE
06h
Yes
Yes
Yes
0
2
WRITE DISABLE
04h
Yes
Yes
Yes
1 to ∞
2
1
2, 8
READ Operations
5
1 to ∞
5
5, 6
1 to ∞
5
5, 7
WRITE Operations
REGISTER Operations
READ STATUS REGISTER
05h
WRITE STATUS REGISTER
01h
READ LOCK REGISTER
E8h
WRITE LOCK REGISTER
E5h
READ FLAG STATUS REGISTER
70h
CLEAR FLAG STATUS REGISTER
50h
READ NONVOLATILE
CONFIGURATION REGISTER
B5h
WRITE NONVOLATILE
CONFIGURATION REGISTER
B1h
READ VOLATILE
CONFIGURATION REGISTER
85h
WRITE VOLATILE
CONFIGURATION REGISTER
81h
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Yes
Yes
Yes
Yes
Yes
Yes
1 to ∞
4
1
4, 8
1 to ∞
2
0
Yes
Yes
Yes
2
2
2, 8
Yes
25
Yes
Yes
1 to ∞
2
1
2, 8
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16Mb, Multiple I/O Serial Flash Memory
Command Definitions
Table 16: Command Set (Continued)
Note 1 applies to entire table
Code
Extended
Dual
I/O
Quad
I/O
Data
Bytes
Notes
READ ENHANCED
VOLATILE CONFIGURATION
REGISTER
65h
Yes
Yes
Yes
1 to ∞
2
WRITE ENHANCED
VOLATILE CONFIGURATION
REGISTER
61h
1
2, 8
Command
PROGRAM Operations
PAGE PROGRAM
02h
Yes
Yes
Yes
1 to 256
4, 8
DUAL INPUT FAST PROGRAM
A2h
Yes
Yes
No
1 to 256
4, 8
EXTENDED DUAL INPUT
FAST PROGRAM
02h
A2h
D2h
Yes
Yes
No
QUAD INPUT FAST PROGRAM
32h
Yes
No
Yes
EXTENDED QUAD INPUT
FAST PROGRAM
02h
32h
12h
Yes
No
Yes
20h
Yes
Yes
Yes
4, 6, 8
1 to 256
4, 8
4, 7, 8
ERASE Operations
SUBSECTOR ERASE (4KB)
SUBSECTOR ERASE (32KB)
52h
SECTOR ERASE
D8h
BULK ERASE
C7h
PROGRAM/ERASE RESUME
7Ah
PROGRAM/ERASE SUSPEND
75h
0
4, 8
2, 8
Yes
Yes
Yes
0
2, 8
Yes
Yes
Yes
1 to 64
5
ONE-TIME PROGRAMMABLE (OTP) Operations
READ OTP ARRAY
4Bh
PROGRAM OTP ARRAY
42h
4
Power-Down
Deep power-down
B9h
Release from deep power-down
ABh
Notes:
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Yes
Yes
Yes
0
2
1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
2. Address bytes = 0. Dummy clock cycles = 0.
3. Dummy clock cycles default = 8.
4. Address bytes = 3. Dummy clock cycles = 0.
5. Address bytes = 3. Dummy clock cycles default = 8. Dummy clock cycles default = 10
(when quad SPI protocol is enabled). Dummy clock cycles is configurable by the user.
6. When the device is in dual SPI protocol, the command can be entered with any of the
three dual FAST READ or dual PROGRAM codes. The different codes enable compatibility between dual SPI and extended SPI protocols.
26
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
7. When the device is in quad SPI protocol, the command can be entered with any of the
three quad FAST READ or quad PROGRAM codes. The different codes enable compatibility between quad SPI and extended SPI protocols.
8. The WRITE ENABLE command must be issued first before this command can be executed.
READ REGISTER and WRITE REGISTER Operations
READ STATUS REGISTER or FLAG STATUS REGISTER Command
To initiate a READ STATUS REGISTER command, S# is driven LOW. For extended SPI
protocol, the command code is input on DQ0, and output on DQ1. For dual SPI protocol, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0], and is output on DQ[3:0]. The operation is
terminated by driving S# HIGH at any time during data output.
The status register can be read continuously and at any time, including during a PROGRAM, ERASE, or WRITE operation.
The flag status register can be read continuously and at any time, including during an
ERASE or WRITE operation.
If one of these operations is in progress, checking the write in progress bit or P/E controller bit is recommended before executing the command.
Figure 8: READ REGISTER Command
Extended
0
7
9
8
10
11
12
13
14
15
C
LSB
Command
DQ0
MSB
LSB
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
Dual
0
3
4
5
6
7
C
LSB
LSB
DOUT
DOUT
Command
DQ[1:0]
MSB
DOUT
DOUT
DOUT
MSB
Quad
0
1
2
3
C
LSB
Command
DQ[3:0]
MSB
Notes:
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DOUT
LSB
DOUT
DOUT
MSB
Don’t Care
1. Supports all READ REGISTER commands except READ LOCK REGISTER.
2. A READ NONVOLATILE CONFIGURATION REGISTER operation will output data starting
from the least significant byte.
27
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
READ NONVOLATILE CONFIGURATION REGISTER Command
To execute a READ NONVOLATILE CONFIGURATION REGISTER command, S# is driven LOW. For extended SPI protocol, the command code is input on DQ0, and output on
DQ1. For dual SPI protocol, the command code is input on DQ[1:0], and output on
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0], and is output
on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during data
output.
The nonvolatile configuration register can be read continuously. After all 16 bits of the
register have been read, a 0 is output. All reserved fields output a value of 1.
READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command
To execute a READ VOLATILE CONFIGURATION REGISTER command or a READ ENHANCED VOLATILE CONFIGURATION REGISTER command, S# is driven LOW. For extended SPI protocol, the command code is input on DQ0, and output on DQ1. For dual
SPI protocol, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad
SPI protocol, the command code is input on DQ[3:0], and is output on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during data output.
When the register is read continuously, the same byte is output repeatedly.
WRITE STATUS REGISTER Command
To issue a WRITE STATUS REGISTER command, the WRITE ENABLE command must be
executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until the
eighth bit of the last data byte has been latched in, after which it must be driven HIGH.
For extended SPI protocol, the command code is input on DQ0, followed by the data
bytes. For dual SPI protocol, the command code is input on DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code is input on DQ[3:0], followed by the
data bytes. When S# is driven HIGH, the operation, which is self-timed, is initiated; its
duration is tW.
This command is used to write new values to status register bits 7:2, enabling software
data protection. The status register can also be combined with the W# signal to provide
hardware data protection. The WRITE STATUS REGISTER command has no effect on
status register bits 1:0.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0, whether the operation is successful or
not.
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 9: WRITE REGISTER Command
Extended
0
7
8
9
10
11
12
13
15
14
C
LSB
LSB
DIN
Command
DQ0
MSB
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
Dual
0
3
4
5
6
7
C
LSB
LSB
DIN
Command
DQ[1:0]
MSB
DIN
DIN
DIN
DIN
MSB
Quad
0
1
2
3
C
LSB
LSB
Command
DQ[3:0]
DIN
DIN
DIN
MSB
MSB
Notes:
1. Supports all WRITE REGISTER commands except WRITE LOCK REGISTER.
2. Waveform must be extended for each protocol, to 23 for extended, 11 for dual, and 5
for quad.
3. A WRITE NONVOLATILE CONFIGURATION REGISTER operation requires data being sent
starting from least significant byte.
WRITE NONVOLATILE CONFIGURATION REGISTER Command
To execute the WRITE NONVOLATILE CONFIGURATION REGISTER command, the
WRITE ENABLE command must be executed to set the write enable latch bit to 1. S# is
driven LOW and held LOW until the 16th bit of the last data byte has been latched in,
after which it must be driven HIGH. For extended SPI protocol, the command code is
input on DQ0, followed by two data bytes. For dual SPI protocol, the command code is
input on DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code
is input on DQ[3:0], followed by the data bytes. When S# is driven HIGH, the operation,
which is self-timed, is initiated; its duration is tWNVCR.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0, whether the operation is successful or
not. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command
To execute a WRITE VOLATILE CONFIGURATION REGISTER command or a WRITE
ENHANCED VOLATILE CONFIGURATION REGISTER command, the WRITE ENABLE
command must be executed to set the write enable latch bit to 1. S# is driven LOW and
held LOW until the eighth bit of the last data byte has been latched in, after which it
must be driven HIGH. For extended SPI protocol, the command code is input on DQ0,
followed by the data bytes. For dual SPI protocol, the command code is input on
DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code is input
on DQ[3:0], followed by the data bytes.
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
If S# is not driven HIGH, the command is not executed, the flag status register error bits
are not set and the write enable latch remains set to 1. Reserved bits are not affected by
this command.
READ LOCK REGISTER Command
To execute the READ LOCK REGISTER command, S# is driven LOW. For extended SPI
protocol, the command code is input on DQ0, followed by three address bytes that
point to a location in the sector. For dual SPI protocol, the command code is input on
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. Each address
bit is latched in during the rising edge of the clock. For extended SPI protocol, data is
shifted out on DQ1 at a maximum frequency fC during the falling edge of the clock. For
dual SPI protocol, data is shifted out on DQ[1:0], and for quad SPI protocol, data is shifted out on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during
data output.
When the register is read continuously, the same byte is output repeatedly. Any READ
LOCK REGISTER command that is executed while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected with no affect on the cycle in progress.
Table 17: Lock Register
Note 1 applies to entire table
Bit
Name
Settings
Description
Reserved
0
Bit values are 0.
1
Sector lock down
0 = Cleared (Default) Volatile bit: the device always powers-up with this bit cleared,
1 = Set
which means sector lock down and sector write lock bits can be
set.
When this bit set, neither of the lock register bits can be written
to until the next power cycle.
0
Sector write lock
0 = Cleared (Default) Volatile bit: the device always powers-up with this bit cleared,
1 = Set
which means that PROGRAM and ERASE operations in this sector
can be executed and sector content modified.
When this bit is set, PROGRAM and ERASE operations in this sector will not be executed.
Note:
1. Sector lock register bits 1:0 are written to by the WRITE LOCK REGISTER command. The
command will not execute unless the sector lock down bit is cleared.
7:2
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 10: READ LOCK REGISTER Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ[0]
MSB
A[MAX]
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
Quad
A[MAX]
0
1
MSB
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
Note:
LSB
DOUT
DOUT
Don’t Care
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).
For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).
WRITE LOCK REGISTER Command
To initiate the WRITE LOCK REGISTER command, the WRITE ENABLE command must
be executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until
the eighth bit of the last data byte has been latched in, after which it must be driven
HIGH. The command code is input on DQn, followed by three address bytes that point
to a location in the sector, and then one data byte that contains the desired settings for
lock register bits 0 and 1. Each address bit is latched in during the rising edge of the
clock.
When execution is complete, the write enable latch bit is cleared within tSHSL2 and no
error bits are set. Because lock register bits are volatile, change to the bits is immediate.
WRITE LOCK REGISTER can be executed when an ERASE SUSPEND operation is in effect. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
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16Mb, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 11: WRITE LOCK REGISTER Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
Dual
A[MAX]
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
Quad
A[MAX]
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).
For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).
CLEAR FLAG STATUS REGISTER Command
To execute the CLEAR FLAG STATUS REGISTER command and reset the error bits
(erase, program, and protection), S# is driven LOW. For extended SPI protocol, the command code is input on DQ0. For dual SPI protocol, the command code is input on
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. The operation
is terminated by driving S# HIGH at any time.
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16Mb, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
READ IDENTIFICATION Operations
READ ID and MULTIPLE I/O READ ID Commands
To execute the READ ID or MULTIPLE I/O READ ID commands, S# is driven LOW and
the command code is input on DQn. The device outputs the information shown in the
tables below. If an ERASE or PROGRAM cycle is in progress when the command is executed, the command is not decoded and the command cycle in progress is not affected.
When S# is driven HIGH, the device goes to standby. The operation is terminated by
driving S# HIGH at any time during data output.
Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands
Command Name
READ ID
MULTIPLE I/O READ ID
Note:
Data In
Data Out
Unique ID
is Output
Extended
Dual
Quad
DQ0
DQ0
Yes
Yes
No
No
DQ[3:0]
DQ[1:0]
No
No
Yes
Yes
1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
Table 19: Read ID Data Out
Size
(Bytes)
Name
Content Value
1
Manufacturer ID
20h
JEDEC
2
Device ID
Memory Type
BBh
Manufacturer
Memory Capacity
15h (16Mb)
17
Assigned by
Unique ID
1 Byte: Length of data to follow
10h
2 Bytes: Extended device ID and device
configuration information
ID and information such as uniform
architecture, and HOLD
or RESET functionality
14 Bytes: Customized factory data
Optional
Note:
Factory
1. The 17 bytes of information in the unique ID is read by the READ ID command, but cannot be read by the MULTIPLE I/O READ ID command.
Table 20: Extended Device ID, First Byte
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Reserved
Reserved
1 = Alternate BP
scheme
0 = Standard BP
scheme
Volatile configuration
register bit setting:
0 = Required
1 = Not required
HOLD#/RESET#:
0 = HOLD
1 = RESET
Addressing:
0 = by byte
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33
Bit 1
Bit 0
Architecture:
00 = Uniform
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16Mb, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Figure 12: READ ID and MULTIPLE I/O Read ID Commands
Extended (READ ID)
0
7
16
15
8
31
32
C
LSB
DQ0
Command
MSB
LSB
DOUT
DOUT
High-Z
DQ1
MSB
DOUT
0
3
UID
Device
identification
8
7
4
LSB
DOUT
DOUT
MSB
MSB
Manufacturer
identification
Dual (MULTIPLE I/O READ ID )
LSB
DOUT
15
C
LSB
DQ[1:0]
LSB
DOUT
DOUT
Command
MSB
MSB
DOUT
MSB
Manufacturer
identification
Quad (MULTIPLE I/O READ ID )
0
LSB
DOUT
1
Device
identification
4
3
2
7
C
LSB
DQ[3:0]
Command
MSB
DOUT
LSB
DOUT
MSB
LSB
DOUT
MSB
Manufacturer
identification
Note:
DOUT
Device
identification
Don’t Care
1. The READ ID command is represented by the extended SPI protocol timing shown first.
The MULTIPLE I/O READ ID command is represented by the dual and quad SPI protocols
are shown below extended SPI protocol.
READ SERIAL FLASH DISCOVERY PARAMETER Command
To execute READ SERIAL FLASH DISCOVERY PARAMETER command, S# is driven
LOW. The command code is input on DQ0, followed by three address bytes and 8 dummy clock cycles in extended or dual SPI protocol or 10 dummy clock cycles in quad SPI
protocol. The device outputs the information starting from the specified address. When
the 2048-byte boundary is reached, the data output wraps to address 0 of the serial
Flash discovery parameter table. The operation is terminated by driving S# HIGH at any
time during data output.
The operation always executes in continuous mode so the read burst wrap setting in the
volatile configuration register does not apply.
Note: Data to be stored in the serial Flash discovery parameter area is still in the definition phase.
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16Mb, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Table 21: Serial Flash Discovery Parameter Data Structure
Compliant with JEDEC standard JC-42.4 1775.03
Address
(Byte Mode)
Address (Bit)
Data
00h
7:0
53h
01h
7:0
46h
02h
7:0
44h
03h
7:0
50h
Minor revision
04h
7:0
00h
Major revision
05h
7:0
01h
Number of parameter headers
06h
7:0
00h
Reserved
07h
7:0
FFh
Parameter ID (0) JEDEC-defined parameter table
08h
7:0
00h
Parameter
Minor revision
09h
7:0
00h
Major revision
Description
Serial Flash discoverable parameters signature
Serial Flash discoverable parameters
0Ah
7:0
01h
Parameter length (DW)
0Bh
7:0
09h
Parameter table pointer
0Ch
7:0
30h
0Dh
7:0
00h
0Eh
7:0
00h
Reserved
0Fh
7:0
FFh
Parameter ID (1)
10h
7:0
FFh
Minor revision
11h
7:0
FFh
Major revision
Parameter
12h
7:0
FFh
Parameter length (DW)
13h
7:0
FFh
Parameter table pointer
14h
7:0
FFh
15h
7:0
FFh
16h
7:0
FFh
Reserved
17h
7:0
FFh
Parameter ID (2)
18h
7:0
FFh
Minor revision
19h
7:0
FFh
Major revision
Parameter
1Ah
7:0
FFh
Parameter length (DW)
1Bh
7:0
FFh
Parameter table pointer
1Ch
7:0
FFh
1Dh
7:0
FFh
1Eh
7:0
FFh
1Fh
7:0
FFh
Reserved
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16Mb, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Table 22: Parameter ID
Compliant with JEDEC standard JC-42.4 1775.03
Description
Minimum block/sector erase sizes
Address
(Byte Mode)
Address (Bit)
Data
30h
0
01b
1
Write granularity
2
1
WRITE ENABLE command required for writing to volatile status registers
3
0
Reserved
5
1
6
1
7
1
4
4KB erase command code
31h
7:0
20h
Supports DUAL OUTPUT FAST READ operation (single input address,
dual output)
32h
0
1
Number of address bytes used for array READ, WRITE, and ERASE
commands
1
0
Supports double transfer rate clocking
3
0
Supports DUAL INPUT/OUTPUT FAST READ operation (dual input address, dual output)
4
1
Supports QUAD INPUT/OUTPUT FAST READ operation (quad input
address, quad output)
5
1
Supports QUAD OUTPUT FAST READ operation (single input address,
quad output)
6
1
Reserved
7
1
33h
7:0
FFh
34h–37h
31:0
007FFFFFh
38h
4:0
01001b
7:5
001b
Reserved
Flash size (bits)
Number of dummy clock cycles required before valid output from
QUAD INPUT/OUTPUT FAST READ operation
2
Number of XIP confirmation bits for QUAD INPUT/OUTPUT FAST
READ operation
Command code for QUAD INPUT/OUTPUT FAST READ operation
39h
7:0
EBh
Number of dummy clock cycles required before valid output from
QUAD OUTPUT FAST READ operation
3Ah
4:0
00111b
7:5
001b
Number of XIP confirmation bits for QUAD OUTPUT FAST READ operation
Command code for QUAD OUTPUT FAST READ operation
3Bh
7:0
6Bh
Number of dummy clock cycles required before valid output from
DUAL OUTPUT FAST READ operation
3Ch
4:0
00111b
7:5
001b
7:0
3Bh
Number of XIP confirmation bits for DUAL OUTPUT FAST READ operation
Command code for DUAL OUTPUT FAST READ operation
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16Mb, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Table 22: Parameter ID (Continued)
Compliant with JEDEC standard JC-42.4 1775.03
Description
Number of dummy clock cycles required before valid output from
DUAL INPUT/OUTPUT FAST READ operation
Address
(Byte Mode)
Address (Bit)
Data
3Eh
4:0
01000b
7:5
001b
Number of XIP confirmation bits for DUAL INPUT/OUTPUT FAST
READ
Command code for DUAL INPUT/OUTPUT FAST READ operation
3Fh
7:0
BBh
Supports FAST READ operation in dual SPI protocol
40h
0
1
3:1
111b
4
1
Reserved
Supports FAST READ operation in quad SPI protocol
Reserved
7:5
111b
Reserved
41h–43h
–
FFFFFFh
Reserved
44h–45h
–
FFFFh
Number of dummy clock cycles required before valid output from
FAST READ operation in dual SPI protocol
46h
4:0
01000b
Number of XIP confirmation bits for FAST READ operation in dual SPI
protocol
46h
7:5
001b
Command code for FAST READ operation in dual SPI protocol
47h
7:0
BBh
48h–49h
–
FFFFh
4Ah
4:0
01010b
7:5
001b
Reserved
Number of dummy clock cycles required before valid output from
FAST READ operation in quad SPI protocol
Number of XIP confirmation bits for FAST READ operation in quad
SPI protocol
Command code for FAST READ operation in quad SPI protocol
4Bh
7:0
EBh
Sector type 1 size (4k)
4Ch
7:0
0Ch
Sector type 1 command code (4k)
4Dh
7:0
20h
Sector type 2 size (64KB)
4Eh
7:0
10h
Sector type 2 command code 64KB)
4Fh
7:0
D8h
Sector type 3 size (not present)
50h
7:0
00h
Sector type 3 size (not present)
51h
7:0
00h
Sector type 4 size (not present)
52h
7:0
00h
Sector type 4 size (not present)
53h
7:0
00h
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16Mb, Multiple I/O Serial Flash Memory
READ MEMORY Operations
READ MEMORY Operations
The device supports default reading and writing to an A[MAX:MIN] of A[23:0].
To execute READ MEMORY commands, S# is driven LOW. The command code is input
on DQn, followed by input on DQn of three address bytes. Each address bit is latched in
during the rising edge of the clock. The addressed byte can be at any location, and the
address automatically increments to the next address after each byte of data is shifted
out; therefore, the entire memory can be read with a single command. The operation is
terminated by driving S# HIGH at any time during data output.
Table 23: Command/Address/Data Lines for READ MEMORY Commands
Note 1 applies to entire table
Command Name
DUAL
QUAD
DUAL OUTPUT INPUT/OUTPUT QUAD OUTPUT INPUT/OUTPUT
FAST READ
FAST READ
FAST READ
FAST READ
READ
FAST
READ
03
0B
3B
BB
6B
EB
Supported
Yes
Yes
Yes
Yes
Yes
Yes
Command Input
DQ0
DQ0
DQ0
DQ0
DQ0
DQ0
Address Input
DQ0
DQ0
DQ0
DQ[1:0]
DQ0
DQ[3:0]
Data Output
DQ1
DQ1
DQ[1:0]
DQ[1:0]
DQ[3:0]
DQ[3:0]
Extended SPI Protocol
Dual SPI Protocol
Supported
No
Yes
Yes
Yes
No
No
Command Input
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
Address Input
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
Data Output
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
No
Yes
No
No
Yes
Yes
Command Input
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Address Input
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Data Output
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Quad SPI Protocol
Supported
Notes:
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1. Yes in the "Supported" row for each protocol indicates that the command in that column is supported; when supported, a command's functionality is identical for the entire
column regardless of the protocol. For example, a FAST READ functions the same for all
three protocols even though its data is input/output differently depending on the protocol.
2. FAST READ is similar to READ, but requires dummy clock cycles following the address
bytes and can operate at a higher frequency (fC).
38
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16Mb, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 13: READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ[0]
MSB
A[MAX]
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Don’t Care
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 14: FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
A[MAX]
DQ1
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
MSB
Don’t Care
Dummy cycles
Note:
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LSB
DOUT
DOUT
1. For extended protocol, Cx = 7 + (A[MAX] + 1); For dual protocol, Cx = 3 + (A[MAX] + 1)/2;
For quad protocol, Cx = 1 + (A[MAX] + 1)/4.
39
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16Mb, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 15: DUAL OUTPUT FAST READ
Extended
0
7
8
Cx
C
LSB
MSB
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
A[MIN]
Command
DQ0
A[MAX]
High-Z
DQ1
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
DOUT
MSB
Dummy cycles
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 16: DUAL INPUT/OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
High-Z
DQ1
A[MAX]
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
DOUT
MSB
Dummy cycles
Note:
PDF: 09005aef84a4754f
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1. Cx = 7 + (A[MAX] + 1)/2.
40
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16Mb, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 17: QUAD OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
LSB
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
A[MAX]
High-Z
DQ[2:1]
DOUT
‘1’
DQ3
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Dummy cycles
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 18: QUAD INPUT/OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
DQ0
Command
A[MIN]
DOUT
LSB
DOUT
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
DQ[2:1]
‘1’
DQ3
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Dummy cycles
Note:
PDF: 09005aef84a4754f
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1. Cx = 7 + (A[MAX] + 1)/4.
41
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16Mb, Multiple I/O Serial Flash Memory
PROGRAM Operations
PROGRAM Operations
PROGRAM commands are initiated by first executing the WRITE ENABLE command to
set the write enable latch bit to 1. S# is then driven LOW and held LOW until the eighth
bit of the last data byte has been latched in, after which it must be driven HIGH. The
command code is input on DQ0, followed by input on DQ[n] of n address bytes and at
least one data byte. Each address bit is latched in during the rising edge of the clock.
When S# is driven HIGH, the operation, which is self-timed, is initiated; its duration is
tPP. The operation is terminated by driving S# HIGH at any time during data output.
If the bits of the least significant address, which is the starting address, are not all zero,
all data transmitted beyond the end of the current page is programmed from the starting address of the same page. If the number of bytes sent to the device exceed the maximum page size, previously latched data is discarded and only the last maximum pagesize number of data bytes are guaranteed to be programmed correctly within the same
page. If the number of bytes sent to the device is less than the maximum page size, they
are correctly programmed at the specified addresses without any effect on the other
bytes of the same page.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. An operation can be
paused or resumed by the PROGRAM/ERASE SUSPEND or PROGRAM/ERASE RESUME
command, respectively. When the operation completes, the write in progress bit is
cleared to 0.
If the operation times out, the write enable latch bit is reset and the program fail bit is
set to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1. When a command is applied
to a protected sector, the command is not executed, the write enable latch bit remains
set to 1, and flag status register bits 1 and 4 are set.
Table 24: Data/Address Lines for PROGRAM Commands
Note 1 applies to entire table
Command Name
PAGE PROGRAM
Data In
Address In
Extended
Dual
Quad
DQ0
DQ0
Yes
Yes
Yes
DUAL INPUT FAST PROGRAM
DQ[1:0]
DQ0
Yes
Yes
No
EXTENDED DUAL INPUT
FAST PROGRAM
DQ[1:0]
DQ[1:0]
Yes
Yes
No
QUAD INPUT FAST PROGRAM
DQ[3:0]
DQ0
Yes
No
Yes
EXTENDED QUAD INPUT
FAST PROGRAM
DQ[3:0]
DQ[3:0]
Yes
No
Yes
Note:
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1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
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16Mb, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 19: PAGE PROGRAM Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
Dual
A[MAX]
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
Quad
A[MAX]
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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16Mb, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 20: DUAL INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
A[MIN]
LSB
Command
DQ0
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
A[MAX]
MSB
High-Z
DQ1
LSB
DIN
MSB
Dual
0
3
4
Cx
C
LSB
A[MIN]
LSB
DIN
Command
DQ[1:0]
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
Figure 21: EXTENDED DUAL INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
DQ0
A[MIN]
LSB
Command
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
High-Z
DQ1
A[MAX]
Dual
0
3
MSB
4
Cx
C
LSB
DQ[1:0]
A[MIN]
LSB
Command
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/2.
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
PDF: 09005aef84a4754f
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16Mb, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 22: QUAD INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
DIN
DIN
DIN
DIN
DIN
DIN
DIN
A[MAX]
High-Z
DQ[3:1]
DIN
MSB
Quad
0
1
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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16Mb, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 23: EXTENDED QUAD INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
LSB
A[MIN]
DIN
DIN
DIN
High-Z
DIN
DIN
DIN
‘1’
DIN
DIN
DIN
DIN
DIN
Command
DQ0
MSB
DQ[2:1]
DQ3
A[MAX]
Quad
0
1
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/4.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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16Mb, Multiple I/O Serial Flash Memory
WRITE Operations
WRITE Operations
WRITE ENABLE Command
The WRITE ENABLE operation sets the write enable latch bit. To execute a WRITE ENABLE command, S# is driven LOW and held LOW until the eighth bit of the command
code has been latched in, after which it must be driven HIGH. The command code is
input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and on
DQ[3:0] for quad SPI protocol.
The write enable latch bit must be set before every PROGRAM, ERASE, and WRITE command. If S# is not driven HIGH after the command code has been latched in, the command is not executed, flag status register error bits are not set, and the write enable
latch remains cleared to its default setting of 0.
WRITE DISABLE Command
The WRITE DISABLE operation clears the write enable latch bit. To execute a WRITE
DISABLE command, S# is driven LOW and held LOW until the eighth bit of the command code has been latched in, after which it must be driven HIGH. The command
code is input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and
on DQ[3:0] for quad SPI protocol.
If S# is not driven HIGH after the command code has been latched in, the command is
not executed, flag status register error bits are not set, and the write enable latch remains set to 1.
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16Mb, Multiple I/O Serial Flash Memory
WRITE Operations
Figure 24: WRITE ENABLE and WRITE DISABLE Command Sequence
Extended
0
1
2
3
4
5
6
7
C
S#
Command Bits
DQ0
0
0
0
0
0
LSB
1
1
0
MSB
High-Z
DQ1
Dual
0
1
3
2
C
S#
Command Bits
DQ0
DQ1
LSB
0
0
1
0
0
0
0
1
MSB
Quad
0
1
C
S#
Command Bits LSB
DQ0
0
0
DQ1
0
1
DQ2
0
1
DQ3
0
0
Don’t Care
MSB
Note:
PDF: 09005aef84a4754f
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1. Shown here is the WRITE ENABLE command code, which is 06h or 0000 0110 binary. The
WRITE DISABLE command sequence is identical, except the WRITE DISABLE command
code is 04h or 0000 0100 binary.
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16Mb, Multiple I/O Serial Flash Memory
ERASE Operations
ERASE Operations
SUBSECTOR ERASE Command
To execute the SUBSECTOR ERASE command (and set the selected subsector bits set to
FFh), the WRITE ENABLE command must be issued to set the write enable latch bit to
1. S# is driven LOW and held LOW until the eighth bit of the last data byte has been
latched in, after which it must be driven HIGH. The command code is input on DQ0,
followed by three address bytes; any address within the subsector is valid. Each address
bit is latched in during the rising edge of the clock. When S# is driven HIGH, the operation, which is self-timed, is initiated; its duration is tSSE. The operation can be suspended and resumed by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME
commands, respectively.
If the write enable latch bit is not set, the device ignores the SUBSECTOR ERASE command and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and the erase error bit is set
to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1. When a command is applied
to a protected subsector, the command is not executed. Instead, the write enable latch
bit remains set to 1, and flag status register bits 1 and 5 are set.
SECTOR ERASE Command
To execute the SECTOR ERASE command (and set selected sector bits to FFh), the
WRITE ENABLE command must be issued to set the write enable latch bit to 1. S# is
driven LOW and held LOW until the eighth bit of the last data byte has been latched in,
after which it must be driven HIGH. The command code is input on DQ0, followed by
three address bytes; any address within the sector is valid. Each address bit is latched in
during the rising edge of the clock. When S# is driven HIGH, the operation, which is
self-timed, is initiated; its duration is tSE. The operation can be suspended and resumed
by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME commands, respectively.
If the write enable latch bit is not set, the device ignores the SECTOR ERASE command
and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1 and the write enable latch bit is cleared to 0, whether the operation is successful or not. The status register and flag status register can be polled for the operation status. When the operation
completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and erase error bit is set to
1. If S# is not driven HIGH, the command is not executed, flag status register error bits
are not set, and the write enable latch remains set to 1. When a command is applied to a
protected sector, the command is not executed. Instead, the write enable latch bit remains set to 1, and flag status register bits 1 and 5 are set.
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16Mb, Multiple I/O Serial Flash Memory
ERASE Operations
Figure 25: SUBSECTOR and SECTOR ERASE Command
Extended
0
7
8
Cx
C
LSB
DQ0
A[MIN]
Command
MSB
Dual
A[MAX]
0
3
4
Cx
C
LSB
DQ0[1:0]
A[MIN]
Command
MSB
Quad
A[MAX]
0
1
2
Cx
C
LSB
MSB
Note:
A[MIN]
Command
DQ0[3:0]
A[MAX]
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
BULK ERASE Command
To initiate the BULK ERASE command, the WRITE ENABLE command must be issued
to set the write enable latch bit to 1. S# is driven LOW and held LOW until the eighth bit
of the last data byte has been latched in, after which it must be driven HIGH. The command code is input on DQ0. When S# is driven HIGH, the operation, which is selftimed, is initiated; its duration is tBE.
If the write enable latch bit is not set, the device ignores the BULK ERASE command
and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1 and the write enable latch bit is cleared to 0, whether the operation is successful or not. The status register and flag status register can be polled for the operation status. When the operation
completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and erase error bit is set to
1. If S# is not driven HIGH, the command is not executed, the flag status register error
bits are not set, and the write enable latch remains set to 1.
The command is not executed if any sector is locked. Instead, the write enable latch bit
remains set to 1, and flag status register bits 1 and 5 are set.
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16Mb, Multiple I/O Serial Flash Memory
ERASE Operations
Figure 26: BULK ERASE Command
Extended
0
7
C
LSB
Command
DQ0
MSB
Dual
0
3
C
LSB
Command
DQ[1:0]
MSB
Quad
0
1
C
LSB
Command
DQ[3:0]
MSB
PROGRAM/ERASE SUSPEND Command
To initiate the PROGRAM/ERASE SUSPEND command, S# is driven LOW. The command code is input on DQ0. The operation is terminated by the PROGRAM/ERASE RESUME command.
PROGRAM/ERASE SUSPEND command enables the memory controller to interrupt
and suspend an array PROGRAM or ERASE operation within the program/erase latency.
If a SUSPEND command is issued during a PROGRAM operation, then the flag status
register bit 2 is set to 1. After erase/program latency time, the flag status register bit 7 is
also set to 1, showing the device to be in a suspended state, waiting for any operation
(see the Operations Allowed/Disallowed During Device States table).
If a SUSPEND command is issued during an ERASE operation, then the flag status register bit 6 is set to 1. After erase/program latency time, the flag status register bit 7 is also
set to 1, showing that device to be in a suspended state, waiting for any operation (see
the Operations Allowed/Disallowed During Device States table).
If the time remaining to complete the operation is less than the suspend latency, the device completes the operation and clears the flag status register bits 2 or 6, as applicable.
Because the suspend state is volatile, if there is a power cycle, the suspend state information is lost and the flag status register powers up as 80h.
During an ERASE SUSPEND operation, a PROGRAM or READ operation is possible in
any sector except the one in a suspended state. Reading from a sector that is in a suspended state will output indeterminate data. The device ignores a PROGRAM command to a sector that is in an ERASE SUSPEND state; it also sets the flag status register
bit 4 to 1: program failure/protection error, and leaves the write enable latch bit unchanged. The commands allowed during an erase suspend state include the WRITE
LOCK REGISTER command, the WRITE VOLATILE CONFIGURATION REGISTER command, and the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command.
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16Mb, Multiple I/O Serial Flash Memory
ERASE Operations
When the ERASE operation resumes, it does not check the new lock status of the WRITE
LOCK REGISTER command.
During a PROGRAM SUSPEND operation, a READ operation is possible in any page except the one in a suspended state. Reading from a page that is in a suspended state will
output indeterminate data. The commands allowed during a program suspend state include the WRITE VOLATILE CONFIGURATION REGISTER command and the WRITE
ENHANCED VOLATILE CONFIGURATION REGISTER command.
It is possible to nest a PROGRAM/ERASE SUSPEND operation inside a PROGRAM/
ERASE SUSPEND operation just once. Issue an ERASE command and suspend it. Then
issue a PROGRAM command and suspend it also. With the two operations suspended,
the next PROGRAM/ERASE RESUME command resumes the latter operation, and a second PROGRAM/ERASE RESUME command resumes the former (or first) operation.
Table 25: Suspend Parameters
Parameter
Condition
Typ
Max
Units
Notes
Erase to suspend
Sector erase or erase resume to erase suspend
150
–
µs
1
Program to suspend
Program resume to program suspend
5
–
µs
1
Subsector erase to suspend
Subsector erase or subsector erase resume to erase suspend
50
–
µs
1
Suspend latency
Program
7
–
µs
2
Suspend latency
Subsector erase
15
–
µs
2
Suspend latency
Erase
15
–
µs
3
Notes:
1. Timing is not internally controlled.
2. Any READ command accepted.
3. Any command except the following are accepted: SECTOR, SUBSECTOR, or BULK ERASE;
WRITE STATUS REGISTER; WRITE NONVOLATILE CONFIGURATION REGISTER; and PROGRAM OTP.
Table 26: Operations Allowed/Disallowed During Device States
Note 1 applies to entire table
Standby
Operation
State
Program or
Erase State
Subsector Erase Suspend or
Program Suspend State
Erase Suspend
State
Notes
READ
Yes
No
Yes
Yes
2
PROGRAM
Yes
No
No
Yes/No
3
ERASE
Yes
No
No
No
4
WRITE
Yes
No
No
No
5
WRITE
Yes
No
Yes
Yes
6
READ
Yes
Yes
Yes
Yes
7
SUSPEND
No
Yes
No
No
8
Notes:
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1. The device can be in only one state at a time. Depending on the state of the device,
some operations are allowed (Yes) and others are not (No). For example, when the device is in the standby state, all operations except SUSPEND are allowed in any sector. For
all device states except the erase suspend state, if an operation is allowed or disallowed
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16Mb, Multiple I/O Serial Flash Memory
ERASE Operations
2.
3.
4.
5.
6.
7.
8.
in one sector, it is allowed or disallowed in all other sectors. In the erase suspend state, a
PROGRAM operation is allowed in any sector except the one in which an ERASE operation has been suspended.
All READ operations except READ STATUS REGISTER and READ FLAG REGISTER. When issued to a sector or subsector that is simultaneously in an erase suspend state, the READ
operation is accepted, but the data output is not guaranteed until the erase has completed.
All PROGRAM operations except PROGRAM OTP. In the erase suspend state, a PROGRAM
operation is allowed in any sector (Yes) except the sector (No) in which an ERASE operation has been suspended.
Applies to the SECTOR ERASE or SUBSECTOR ERASE operation.
Applies to the following operations: WRITE STATUS REGISTER, WRITE NONVOLATILE
CONFIGURATION REGISTER, PROGRAM OTP, and BULK ERASE.
Applies to the following operations: WRITE ENABLE, WRITE DISABLE, CLEAR FLAG STATUS REGISTER, WRITE LOCK REGISTER, WRITE VOLATILE, and ENHANCED VOLATILE CONFIGURATION REGISTER.
Applies to the READ STATUS REGISTER or READ FLAG STATUS REGISTER operation.
Applies to the PROGRAM SUSPEND or ERASE SUSPEND operation.
PROGRAM/ERASE RESUME Command
To initiate the PROGRAM/ERASE RESUME command, S# is driven LOW. The command
code is input on DQ0. The operation is terminated by driving S# HIGH.
When this command is executed, the status register write in progress bit is set to 1, and
the flag status register program erase controller bit is set to 0. This command is ignored
if the device is not in a suspended state.
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16Mb, Multiple I/O Serial Flash Memory
RESET Operations
RESET Operations
Table 27: Reset Command Set
Command
Command Code (Binary)
Command Code (Hex)
Address Bytes
RESET ENABLE
0110 0110
66
0
RESET MEMORY
1001 1001
99
0
RESET ENABLE and RESET MEMORY Command
To reset the device, the RESET ENABLE command must be followed by the RESET
MEMORY command. To execute each command, S# is driven LOW. The command code
is input on DQ0. A minimum de-selection time of tSHSL2 must come between the RESET ENABLE and RESET MEMORY commands or a reset is not guaranteed. When these
two commands are executed and S# is driven HIGH, the device enters a power-on reset
condition. A time of tSHSL3 is required before the device can be re-selected by driving
S# LOW. It is recommended that the device exit XIP mode before executing these two
commands to initiate a reset.
If a reset is initiated while a WRITE, PROGRAM, or ERASE operation is in progress or
suspended, the operation is aborted and data may be corrupted.
Figure 27: RESET ENABLE and RESET MEMORY Command
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
C
Reset enable
Reset memory
S#
DQ0
Note:
1. The number of lines and rate for transmission varies with extended, dual, or quad SPI.
RESET Conditions
All volatile lock bits, the volatile configuration register, and the enhanced volatile configuration register are reset to the power-on reset default condition. The power-on reset
condition depends on settings in the nonvolatile configuration register.
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16Mb, Multiple I/O Serial Flash Memory
ONE TIME PROGRAMMABLE Operations
ONE TIME PROGRAMMABLE Operations
READ OTP ARRAY Command
To initiate a READ OTP ARRAY command, S# is driven LOW. The command code is input on DQ0, followed by three bytes and dummy clock cycles. Each address bit is latched in during the rising edge of C. Data is shifted out on DQ1, beginning from the specified address and at a maximum frequency of fC (MAX) on the falling edge of the clock.
The address increments automatically to the next address after each byte of data is shifted out. There is no rollover mechanism; therefore, if read continuously, after location
40h, the device continues to output data at location 40h. The operation is terminated by
driving S# HIGH at any time during data output.
Figure 28: READ OTP Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
A[MAX]
DQ1
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Don’t Care
Dummy cycles
Note:
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
PROGRAM OTP ARRAY Command
To initiate the PROGRAM OTP ARRAY command, the WRITE ENABLE command must
be issued to set the write enable latch bit to 1; otherwise, the PROGRAM OTP ARRAY
command is ignored and flag status register bits are not set. S# is driven LOW and held
LOW until the eighth bit of the last data byte has been latched in, after which it must be
driven HIGH. The command code is input on DQ0, followed by three bytes and at least
one data byte. Each address bit is latched in during the rising edge of the clock. When S#
is driven HIGH, the operation, which is self-timed, is initiated; its duration is tPOTP.
There is no rollover mechanism; therefore, after a maximum of 65 bytes are latched in
and subsequent bytes are discarded.
PROGRAM OTP ARRAY programs, at most, 64 bytes to the OTP memory area and one
OTP control byte. When the operation is in progress, the write in progress bit is set to 1.
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16Mb, Multiple I/O Serial Flash Memory
ONE TIME PROGRAMMABLE Operations
The write enable latch bit is cleared to 0, whether the operation is successful or not, and
the status register and flag status register can be polled for the operation status. When
the operation completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and the program fail bit is
set to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
The OTP control byte (byte 64) is used to permanently lock the OTP memory array.
Table 28: OTP Control Byte (Byte 64)
Bit Name
0
OTP control byte
Settings
Description
0 = Locked
1 = Unlocked
(Default)
Used to permanently lock the OTP array (byte 64). When bit 0 = 1, the
OTP array can be programmed. When bit 0 = 0, the OTP array is read only.
Once bit 0 has been programmed to 0, it can no longer be changed to 1.
PROGRAM OTP ARRAY is ignored, write enable latch bit remains set, and
flag status register bits 1 and 4 are set.
Figure 29: PROGRAM OTP Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
Dual
A[MAX]
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
Quad
A[MAX]
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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16Mb, Multiple I/O Serial Flash Memory
XIP Mode
XIP Mode
Execute-in-place (XIP) mode allows the memory to be read by sending an address to the
device and then receiving the data on one, two, or four pins in parallel, depending on
the customer requirements. XIP mode offers maximum flexibility to the application,
saves instruction overhead, and reduces random access time.
Activate or Terminate XIP Using Volatile Configuration Register
Applications that boot in SPI and must switch to XIP use the volatile configuration register. XIP provides faster memory READ operations by requiring only an address to execute, rather than a command code and an address.
To activate XIP requires two steps. First, enable XIP by setting volatile configuration register bit 3 to 0. Next, drive the XIP confirmation bit to 0 during the next FAST READ operation. XIP is then active. Once in XIP, any command that occurs after S# is toggled requires only address bits to execute; a command code is not necessary, and device operations use the SPI protocol that is enabled. XIP is terminated by driving the XIP confirmation bit to 1. The device automatically resets volatile configuration register bit 3 to 1.
Note: For devices with basic XIP, indicated by a part number feature set digit of 2 or 4, it
is not necessary to set the volatile configuration register bit 3 to 0 to enable XIP. Instead,
it is enabled by setting the XIP confirmation bit to 0 during the first dummy clock cycle
after any FAST READ command.
Activate or Terminate XIP Using Nonvolatile Configuration Register
Applications that must boot directly in XIP use the nonvolatile configuration register. To
enable a device to power-up in XIP using the nonvolatile configuration register, set nonvolatile configuration register bits [11:9]. Settings vary according to protocol, as explained in the Nonvolatile Configuration Register section. Because the device boots directly in XIP, the confirmation bit is already set to 0, and after the next power cycle, XIP
is active. Once in XIP, a command code is unnecessary, and device operations use the
SPI protocol currently enabled. XIP is terminated by driving the XIP confirmation bit to
1.
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16Mb, Multiple I/O Serial Flash Memory
XIP Mode
Figure 30: XIP Mode Directly After Power-On
0
Mode 3
C
2
3
4
5
6
7
8
9
10
11
12
13
14
15 16
Mode 0
tVSI
VCC
1
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